Atomic Layer Deposition(ALD)
Equipment manager: Sichao Li
Equipment overview : The TFS 500 is designed for diverse use in thin film coating applications. Being the first Beneq reactor model, has proven its case as a versatile tool for both in-depth thin film research and robust batch processing. The TFS 500 is an ideal tool for multi-project environments.The TFS 500 can handle several types of substrates; wafers, planar objects, particles and porous bulk materials, as well as complex 3D objects with high aspect ratio features. It can further be equipped with a manually operated load lock for increased wafer processing capabilities. Different types of reaction chambers can easily be fitted inside the vacuum chamber, which in turn enables optimizing each reaction chamber for each customer application.The TFS 500 meets both the stringent requirements of industrial reliability and the need for flexibility of R&D operations. Process components are off-the-shelf articles, which ensures spare parts availability. All precursor containers can easily be changed, at short notice. The precursor readiness includes gases, liquids and solid materials. For full flexibility in precursor selection, we have additionally included a 500 °C hot source option.
Equipment specification
Equipment category:    Atomic Layer Deposition(ALD)
Version :    TFS200
Manufacturer :    Beneq
Features :    Deposition uniform film
Compositions:    Reaction chamber ,Control system
Contact Address: Hubei Province Wuhan City Hongshan District Luo Yu Road No. 1037, Huazhong University of Science and Technology, East Campus, Postal Code: 430074, China Tel: 027-87792334-8118 E-mail: wulab_hust@163.com     Hubei ICP 11002378 -1   Back-stage Management